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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9984898 B1

PDFFull Text
Date of Patent:
May. 29, 2018

Filed:

Jun. 22, 2017

Substrate, semiconductor package including the same, and method for manufacturing the same

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Li Chuan Tsai, Kaohsiung, TW;

Chih-Cheng Lee, Kaohsiung, TW;

Cheng-Lin Ho, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorneys:

Foley & Lardner LLP

Cliff Z. Liu

Primary Examiner:

David Vu

Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4857 (2013.01); H01L 21/563 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/498 (2013.01); H01L 24/16 (2013.01);
Abstract

A substrate includes a dielectric layer having a first surface and a second surface opposite to the first surface, a first circuit layer and at least one second conductive element. The first circuit layer is disposed adjacent to the first surface of the dielectric layer, and includes at least one trace and at least one first conductive element connected to the trace. The first conductive element does not extend through the dielectric layer. The second conductive element extends through the dielectric layer. An area of an upper surface of the second conductive element is substantially equal to an area of an upper surface of the first conductive element.

Find Patent Forward Citations

Tsai, Li. (2018). Substrate, semiconductor package including the same, and method for manufacturing the same (U.S. Patent No. 9984898). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9984898

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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