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For the Inventor, By the Inventor

HEFEI, China

Li Bai

This inventor holds 10 USPTO granted patents. Top assignee: Changxin Memory Technologies, Inc.. Active years: 2024-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Li Bai. Retrieved from https://idiyas.com/inventor/li-bai-1l9csgjv

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10

% Patents Active = 90.0

Average Co-Inventor Count = 3.7

ph-index = 1


Location History:

  • Hefei, CN (2024)
  • Shanghai, CN (2024)

Company Filing History:

goldMedal10 out of 1,856 
 
Changxin Memory Technologies, Inc.
 patents

Years Active: 2024-2026

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10 patents (USPTO):Explore Patents
1. 12579349 - Method and apparatus for automatic expansion of storage array, device and medium (2026-03-17),
2. 12547812 - Method and apparatus for checking signal line (2026-02-10),
3. 12541630 - Method for layout placement and routing, circuit layout, electronic device, and storage medium (2026-02-03),
4. 12437137 - Method and apparatus of designing integrated circuit (2025-10-07),
5. 12423497 - Layout repairing method and apparatus, computer device, and storage medium (2025-09-23),
6. 12361196 - DRC test pattern generation method and apparatus, electronic device, and storage medium (2025-07-15),
7. 12242791 - Semiconductor integrated circuit design method and apparatus (2025-03-04),
8. 12164852 - Layout method and layout apparatus for integrated circuit (2024-12-10),
9. 11989499 - Method and apparatus for adjusting metal wiring density (2024-05-21),
10. 11983480 - Check tool and check method for design rule check rule deck of integrated circuit layout (2024-05-14),

Title: Innovations of Li Bai in Integrated Circuit Design

Introduction

Li Bai is a prominent inventor based in Hefei, China, known for his significant contributions to the field of integrated circuit design. With a total of seven patents to his name, he has developed innovative methods and apparatuses that enhance the efficiency and reliability of semiconductor technologies.

Latest Patents

Among his latest patents, Li Bai has introduced a method and apparatus for designing integrated circuits. This method involves loading a power fill to a circuit layout with original metal lines, checking for spacing errors, and pruning power fill shapes to correct any identified issues. Another notable patent focuses on a layout repairing method and apparatus, which includes obtaining an initial layout of a semiconductor integrated circuit and forming a power fill grid that optimizes the layout for better performance.

Career Highlights

Li Bai is currently employed at Changxin Memory Technologies, Inc., where he applies his expertise in integrated circuit design. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable for various applications.

Collaborations

Li Bai collaborates with talented individuals in his field, including Chuanjiang Chen and Kang Zhao, who contribute to the innovative projects at Changxin Memory Technologies, Inc.

Conclusion

Li Bai's contributions to integrated circuit design through his patents and collaborative efforts highlight his role as a key innovator in the semiconductor industry. His work continues to influence advancements in technology and improve the performance of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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