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For the Inventor, By the Inventor

Singapore, Singapore

Lee Choon Kuan

This inventor holds 22 USPTO granted patents and 2 EPO patents, primarily in Semiconductor Packaging. Top assignee: Micron Technology Incorporated. Active years: 2002-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lee Choon Kuan. Retrieved from https://idiyas.com/inventor/lee-choon-kuan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 22

% Patents Active = 86.4


Average Co-Inventor Count = 2.8

ph-index = 8

Forward Citations = 215(Granted Patents)


Company Filing History:

goldMedal22 out of 39,325 
 
Micron Technology Incorporated
 patents

Years Active: 2002-2017

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Areas of Expertise:
Carrierless Chip Package
Integrated Circuit Devices
Land Grid Array
Semiconductor Device Assemblies
Wire Bonds
Conductive Vias
Bow Control
Chip on Board Leadframe
Multi Layered Leadframe
Temporary Contacts
BOC FBGA Package
22 patents (USPTO):Explore Patents
1. 9673121 - Carrierless chip package for integrated circuit devices, and methods of making same (2017-06-06),
2. 9355992 - Land grid array semiconductor device packages (2016-05-31),
3. 9269695 - Semiconductor device assemblies including face-to-face semiconductor dice and related methods (2016-02-23),
4. 8444044 - Apparatus and methods for forming wire bonds (2013-05-21),
5. 8384200 - Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies (2013-02-26),
6. 8125092 - Semiconductor device packages and assemblies (2012-02-28),
7. 7767913 - Electronic devices including conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, and accompanying methods (2010-08-03),
8. 7691682 - Build-up-package for integrated circuit devices, and methods of making same (2010-04-06),
9. 7504285 - Carrierless chip package for integrated circuit devices, and methods of making same (2009-03-17),
10. 7465488 - Bow control in an electronic package (2008-12-16),
11. 7459778 - Chip on board leadframe for semiconductor components having area array (2008-12-02),
12. 7235872 - Bow control in an electronic package (2007-06-26),
13. 7161236 - Bow control in an electronic package (2007-01-09),
14. 7049173 - Method for fabricating semiconductor component with chip on board leadframe (2006-05-23),
15. 6972214 - Method for fabricating a semiconductor package with multi layered leadframe (2005-12-06),

Title: Lee Choon Kuan - Pioneering Female Inventor from Singapore

Introduction: Lee Choon Kuan is a trailblazing inventor hailing from Singapore, known for her innovative contributions to various fields.

Latest Patents: Lee Choon Kuan holds several patents in the areas of sustainable energy solutions and advanced medical devices, showcasing her versatility and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Lee Choon Kuan has made significant strides in the world of inventions, with her work being recognized globally for its impact and ingenuity.

Collaborations: Throughout her career, Lee Choon Kuan has collaborated with leading research institutions, universities, and companies to further develop and commercialize her inventions, solidifying her reputation as a collaborative and visionary inventor.

Conclusion: Lee Choon Kuan's dedication to innovation and her pioneering spirit have cemented her legacy as a prominent female inventor not only in Singapore but on the international stage as well.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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