Berlin, Germany

Lars Böttcher

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignees: Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.v., Technische Unversität Berlin. Active years: 2006-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lars Böttcher. Retrieved from https://idiyas.com/inventor/lars-böttcher-vceny73i

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 50.0

Average Co-Inventor Count = 4.8

ph-index = 2

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 2006-2015

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Lars Böttcher: Innovator in Electronic Assembly Technologies

Introduction

Lars Böttcher is a prominent inventor based in Berlin, Germany. He has made significant contributions to the field of electronic assembly, holding 2 patents that showcase his innovative approach to integrating electronic components.

Latest Patents

One of his latest patents is titled "Electronic assembly including an embedded electronic component." This invention involves producing an electronic unit that includes at least one electronic component partially embedded in an insulating material. The design features a film assembly with a conductive layer and a carrier layer, where the conductive layer has openings for receiving bumps connected to the contact surfaces of the electronic component. The component is strategically placed on the film assembly, allowing the bumps to engage with the openings. The process includes embedding the component into a dielectric layer and removing the carrier layer to expose the bumps, followed by depositing a metallization layer to create conductor tracks.

Another notable patent is the "Method for producing encapsulated chips." This method outlines a process for preparing a wafer with contacts that project from its surface. The wafer is placed on a dicing substrate and diced into multiple chips. After covering the contacts with a protection arrangement, injection molding is performed to introduce encapsulation material. The protection arrangement is then removed, exposing the contacts for further use.

Career Highlights

Lars Böttcher has worked with esteemed organizations such as Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. and Technische Universität Berlin. His experience in these institutions has allowed him to refine his skills and contribute to groundbreaking research in electronic assembly technologies.

Collaborations

Throughout his career, Lars has collaborated with notable professionals, including Andreas Ostmann and Karl-Friedrich Becker. These partnerships have fostered innovation and advancement in their respective fields.

Conclusion

Lars Böttcher's contributions to electronic assembly technologies through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of advanced electronic components and methods.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…