Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Technische Unversität Berlin

Lars Böttcher

Andreas Ostmann

Tanja Braun

Dionysios Manessis

Erik Jung

Karl-Friedrich Becker

Stefan Karaszkiewicz

Mathias Koch

An electronic unit is produced including at least one electronic component at least partially embedded in an insulating material. A film assembly is provided with at least one conductive layer and a carrier layer. The conductive layer includes openings in the form of holes for receiving bumps, which are connected to contact surfaces of the at least one electronic component. The at least one component is placed on the film assembly such that the bumps engage with the openings of the conductive layer. The at least one component is partially embedded from the side opposite of the bumps into a dielectric layer. The carrier layer of the film assembly is removed such that the surface of the bumps is exposed. A metallization layer is then deposited on the side of the remaining conductive layer having the exposed bumps and so as to produce conductor tracks that overlap with the bumps.

Electronic assembly including an embedded electronic component

A method for producing encapsulated chips includes preparing a wafer with contacts projecting from a surface of the wafer. The wafer is disposed on a dicing substrate and diced into a plurality of spaced chips on the dicing substrate. The contacts are covered with a protection arrangement, then injection molding being conducted to introduce encapsulation material into the contacts and the trenches. Then the protection arrangement is removed so that the contacts are exposed.

Method for producing encapsulated chips

Growing community of inventors

Berlin, Germany

Lars Böttcher