The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2015
Filed:
Dec. 14, 2010
Andreas Ostmann, Berlin, DE;
Dionysios Manessis, Berlin, DE;
Lars Böttcher, Berlin, DE;
Stefan Karaszkiewicz, Berlin, DE;
Andreas Ostmann, Berlin, DE;
Dionysios Manessis, Berlin, DE;
Lars Böttcher, Berlin, DE;
Stefan Karaszkiewicz, Berlin, DE;
Technische Universität Berlin, Berlin, DE;
Fraunhofer-Gesellschaft zur Foerderung der angewandt Forschung e.V., Munich, DE;
Abstract
An electronic unit is produced including at least one electronic component at least partially embedded in an insulating material. A film assembly is provided with at least one conductive layer and a carrier layer. The conductive layer includes openings in the form of holes for receiving bumps, which are connected to contact surfaces of the at least one electronic component. The at least one component is placed on the film assembly such that the bumps engage with the openings of the conductive layer. The at least one component is partially embedded from the side opposite of the bumps into a dielectric layer. The carrier layer of the film assembly is removed such that the surface of the bumps is exposed. A metallization layer is then deposited on the side of the remaining conductive layer having the exposed bumps and so as to produce conductor tracks that overlap with the bumps.