This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignees: Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.v., Technische Unversität Berlin. Active years: 2015.
Company Filing History:
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Years Active: 2015
Title: The Innovative Contributions of Stefan Karaszkiewicz
Introduction
Stefan Karaszkiewicz is a notable inventor based in Berlin, Germany. He has made significant contributions to the field of electronic assembly, particularly with his innovative patent that enhances the integration of electronic components.
Latest Patents
Stefan holds a patent for an "Electronic assembly including an embedded electronic component." This invention involves producing an electronic unit that includes at least one electronic component partially embedded in an insulating material. The design features a film assembly with conductive and carrier layers, where the conductive layer has openings for receiving bumps connected to the component's contact surfaces. The component is strategically placed to ensure proper engagement with the conductive layer, and a metallization layer is deposited to create conductor tracks that overlap with the bumps. This innovative approach improves the efficiency and functionality of electronic assemblies.
Career Highlights
Throughout his career, Stefan has worked with prestigious organizations such as the Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. and Technische Universität Berlin. His experience in these institutions has allowed him to refine his skills and contribute to groundbreaking research in electronic engineering.
Collaborations
Stefan has collaborated with notable colleagues, including Andreas Ostmann and Lars Böttcher. These partnerships have fostered a creative environment that has led to advancements in their respective fields.
Conclusion
Stefan Karaszkiewicz's innovative work in electronic assembly showcases his expertise and dedication to advancing technology. His contributions are significant in the realm of electronics, and his patent reflects a commitment to improving electronic component integration.