The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2006
Filed:
Oct. 30, 2003
Karl-friedrich Becker, Berlin, DE;
Tanja Braun, Berlin, DE;
Mathias Koch, Berlin, DE;
Andreas Ostmann, Berlin, DE;
Lars Böttcher, Berlin, DE;
Erik Jung, Falkensee, DE;
Karl-Friedrich Becker, Berlin, DE;
Tanja Braun, Berlin, DE;
Mathias Koch, Berlin, DE;
Andreas Ostmann, Berlin, DE;
Lars Böttcher, Berlin, DE;
Erik Jung, Falkensee, DE;
Abstract
A method for producing encapsulated chips includes preparing a wafer with contacts projecting from a surface of the wafer. The wafer is disposed on a dicing substrate and diced into a plurality of spaced chips on the dicing substrate. The contacts are covered with a protection arrangement, then injection molding being conducted to introduce encapsulation material into the contacts and the trenches. Then the protection arrangement is removed so that the contacts are exposed.