Berlin, Germany

Mathias Koch

This inventor holds 1 USPTO granted patent. Top assignee: Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.v.. Active years: 2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mathias Koch. Retrieved from https://idiyas.com/inventor/mathias-koch-ztoes63s

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2006

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1 patent (USPTO):Explore Patents

Title: Mathias Koch - Innovator in Chip Encapsulation Technology

Introduction

Mathias Koch is a prominent inventor based in Berlin, Germany. He is known for his innovative contributions to the field of chip encapsulation technology. With a focus on enhancing the production methods of encapsulated chips, Koch has made significant strides in this area.

Latest Patents

Koch holds a patent for a "Method for producing encapsulated chips." This method involves preparing a wafer with contacts projecting from its surface. The wafer is then placed on a dicing substrate and diced into multiple spaced chips. Following this, the contacts are covered with a protective arrangement, and injection molding is conducted to introduce encapsulation material into the contacts and trenches. Finally, the protection arrangement is removed, exposing the contacts.

Career Highlights

Mathias Koch is associated with the Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., a leading research organization in Germany. His work has contributed to advancements in semiconductor technology and manufacturing processes.

Collaborations

Koch has collaborated with notable colleagues, including Karl-Friedrich Becker and Lars Böttcher. Their combined expertise has furthered research and development in the field of chip technology.

Conclusion

Mathias Koch's innovative methods for producing encapsulated chips demonstrate his commitment to advancing technology in the semiconductor industry. His contributions continue to influence the field and inspire future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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