Company Filing History:
Years Active: 2015-2025
Title: Innovations of KwanJai Lee in Semiconductor Technology
Introduction
KwanJai Lee is a prominent inventor based in Yongin-si, South Korea, known for his significant contributions to semiconductor technology. With a total of eight patents to his name, Lee has made remarkable advancements in the field, particularly in chip-on-film packaging.
Latest Patents
Among his latest patents is a "Chip-on-film package having redistribution pattern between semiconductor chip and connection terminal." This innovative package includes a film substrate with a semiconductor chip mounted on it, featuring a unique redistribution pattern that enhances connectivity. Another notable patent is the "Chip on film package with trench to reduce slippage and display device including the same." This design incorporates a trench within the bump structure, which helps to stabilize the semiconductor chip and improve performance.
Career Highlights
KwanJai Lee has built a successful career at Samsung Electronics Co., Ltd., where he has been instrumental in developing cutting-edge technologies. His work has not only advanced the company's product offerings but has also contributed to the broader semiconductor industry.
Collaborations
Lee has collaborated with talented colleagues, including Jeong-Kyu Ha and Jae-Min Jung, who have played vital roles in his projects. Their teamwork has fostered an environment of innovation and creativity, leading to the successful development of new technologies.
Conclusion
KwanJai Lee's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the industry. His work continues to influence advancements in chip packaging and semiconductor design.