The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2016
Filed:
Jan. 23, 2013
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Jeong-Kyu Ha, Hwaseong-si, KR;
Youngshin Kwon, Osan-si, KR;
KwanJai Lee, Yongin-si, KR;
Jae-Min Jung, Seoul, KR;
KyongSoon Cho, Goyang-si, KR;
Sang-Uk Han, Hwaseong-si, KR;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/14 (2006.01); H05K 1/11 (2006.01); H05K 3/10 (2006.01); H01L 23/00 (2006.01); H05K 3/00 (2006.01); H05K 1/18 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H01L 23/145 (2013.01); H01L 24/50 (2013.01); H05K 1/114 (2013.01); H05K 3/0052 (2013.01); H05K 3/107 (2013.01); H05K 1/189 (2013.01); H05K 3/42 (2013.01); H05K 2203/1545 (2013.01); Y10T 156/1052 (2015.01);
Abstract
A tape film package is provided including an insulating pattern; a via contact in a via hole in the insulating pattern; first interconnection patterns extending from the via contact to a cutting surface of the insulating pattern; and second interconnection patterns connected to the via contact below the insulating pattern. The second interconnection patterns are parallel to the first interconnection patterns and spaced apart from the cutting surface of the insulating pattern.