The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2015
Filed:
Jun. 25, 2012
Applicants:
Sang-uk Han, Hwaseong-si, KR;
Jeong-kyu Ha, Hwaseong-si, KR;
Youngshin Kwon, Osan-si, KR;
Seung Hwan Kim, Incheon, KR;
Kwanjai Lee, Yongin-si, KR;
Inventors:
Sang-Uk Han, Hwaseong-si, KR;
Jeong-Kyu Ha, Hwaseong-si, KR;
Youngshin Kwon, Osan-si, KR;
Seung Hwan Kim, Incheon, KR;
KwanJai Lee, Yongin-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); H01L 24/81 (2013.01); H01L 21/6835 (2013.01); H01L 21/561 (2013.01); H01L 24/13 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/81001 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01);
Abstract
Provided are methods of forming semiconductor modules. The method includes forming a high polymer material layer having an adhesive property on a support substrate, adhering a semiconductor chip to the support substrate using the high polymer material layer, bonding the semiconductor chip adhered to the support substrate to a flexible panel, and removing the support substrate.