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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9620389 B1

PDFFull Text
Date of Patent:
Apr. 11, 2017

Filed:

Dec. 14, 2015

Methods of fabricating tape film packages

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Jeong-Kyu Ha, Hwaseong-si, KR;

Youngshin Kwon, Osan-si, KR;

KwanJai Lee, Yongin-si, KR;

Jae-Min Jung, Seoul, KR;

KyongSoon Cho, Goyang-si, KR;

Sang-Uk Han, Hwaseong-si, KR;

Assignee:

Samsung Electronics Co., Ltd., , KR;

Attorney:

Ward and Smith, P.A.

Primary Examiner:

Robert Bachner

Assistant Examiner:

Molly Reida

Int. Cl.
CPC ...
H01L 23/14 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 1/11 (2006.01); H05K 3/10 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H05K 3/00 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H05K 1/18 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/563 (2013.01); H01L 21/78 (2013.01); H01L 23/145 (2013.01); H01L 23/4985 (2013.01); H01L 23/49524 (2013.01); H01L 23/49827 (2013.01); H01L 24/50 (2013.01); H05K 1/114 (2013.01); H05K 1/115 (2013.01); H05K 3/0052 (2013.01); H05K 3/107 (2013.01); H01L 2924/12042 (2013.01); H05K 1/189 (2013.01); H05K 3/42 (2013.01); H05K 2203/1545 (2013.01); Y10T 156/1052 (2015.01);
Abstract

A tape film package is provided including an insulating pattern; a via contact in a via hole in the insulating pattern; first interconnection patterns extending from the via contact to a cutting surface of the insulating pattern; and second interconnection patterns connected to the via contact below the insulating pattern. The second interconnection patterns are parallel to the first interconnection patterns and spaced apart from the cutting surface of the insulating pattern.

Find Patent Forward Citations

Ha, Jeong-Kyu. (2017). Methods of fabricating tape film packages (U.S. Patent No. 9620389). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9620389

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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