Kuo Cheng Lin

Title: Innovations by Kuo Cheng Lin in Integrated Circuit Technology

Introduction

Kuo Cheng Lin is a notable inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of integrated circuit technology, particularly in the development of solder pillar bumps. With a total of three patents to his name, Lin's work has enhanced the reliability and efficiency of electronic connections.

Latest Patents

One of Lin's latest patents is focused on "Pillar bumps and process for making same - Apparatus and methods for providing solder pillar bumps." This innovation involves forming pillar bump connections on input/output terminals for integrated circuits. The process includes plating a conductive material over the terminals of an integrated circuit to create a pillar of conductive material. The design features a base portion of the pillar bump that has a greater width than the upper portion. The cross-section of the base can take on trapezoidal, rectangular, or sloping shapes. Additionally, solder material is formed on the top surface of the pillar, resulting in fine pitch package solder connections that are more reliable than those found in prior art.

Career Highlights

Kuo Cheng Lin is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing the technology used in integrated circuits, making them more efficient and reliable.

Collaborations

Lin has collaborated with notable colleagues such as Cheng-Chung Lin and Chung-Shi Liu. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Kuo Cheng Lin's contributions to integrated circuit technology through his innovative patents have significantly impacted the field. His work continues to pave the way for advancements in electronic connections, ensuring greater reliability in modern technology.