The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Aug. 30, 2010
Cheng-chung Lin, Taipei, TW;
Chung-shi Liu, Shin-Chu, TW;
Meng-wei Chou, Zhubei, TW;
Kuo Cheng Lin, Hsin-Chu, TW;
Wen-hsiung LU, Jhonghe, TW;
Chien Ling Hwang, Hsin-Chu, TW;
Ying-jui Huang, Taipei, TW;
De-yuan LU, Taipei, TW;
Cheng-Chung Lin, Taipei, TW;
Chung-Shi Liu, Shin-Chu, TW;
Meng-Wei Chou, Zhubei, TW;
Kuo Cheng Lin, Hsin-Chu, TW;
Wen-Hsiung Lu, Jhonghe, TW;
Chien Ling Hwang, Hsin-Chu, TW;
Ying-Jui Huang, Taipei, TW;
De-Yuan Lu, Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using plating of a conductive material over terminals of an integrated circuit. A base portion of the pillar bump has a greater width than an upper portion. A cross-section of the base portion of the pillar bump may make a trapezoidal, rectangular or sloping shape. Solder material may be formed on the top surface of the pillar. The resulting solder pillar bumps form fine pitch package solder connections that are more reliable than those of the prior art.