This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2025.
Company Filing History:
Years Active: 2025
Title: Innovations of Kung-Ming Liu
Introduction: Kung-Ming Liu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology. His work primarily focuses on enhancing the manufacturing processes of semiconductor devices.
Latest Patents: Kung-Ming Liu holds a patent for a CMP safe alignment mark. This patent describes techniques for creating an alignment mark on a wafer. A recess is etched in a first surface region of the wafer. A device structure is formed in a second surface region of the wafer. A dielectric layer is deposited on the first surface of the wafer, filling the recess. A first planarization procedure is conducted to planarize the dielectric layer. After this, a second planarization procedure is performed on the device structures in the second surface region of the wafer. This innovation is crucial for improving the accuracy and efficiency of semiconductor manufacturing.
Career Highlights: Liu is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His work there has been instrumental in advancing the company's technological capabilities. He has been recognized for his innovative approaches and dedication to research and development.
Collaborations: Throughout his career, Kung-Ming Liu has collaborated with talented individuals such as Jheng-Si Su and Huang-Jen Hsu. These collaborations have fostered a creative environment that encourages innovation and problem-solving.
Conclusion: Kung-Ming Liu's contributions to semiconductor technology through his patent and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in manufacturing processes, showcasing the importance of innovation in technology.