Taiwan Semiconductor Manufacturing Comp. Ltd.

Kung-Ming Liu

Feng-Inn Wu

Jheng-Si Su

Huang-Jen Hsu

Tzuyi Hsieh

The current disclosure describes techniques for making an alignment mark on a wafer. A recess is etched in a first surface region of a wafer. A device structure is formed in a second surface region of the wafer. A dielectric layer is deposited on the first surface of the wafer and filling the recess. A first planarization procedure is conducted to planarize the dielectric layer. After the first planarization procedure, a second planarization procedure is conducted to device structures on the second surface region of the wafer.

Growing community of inventors

Hsinchu, Taiwan

Kung-Ming Liu