Kun-Yuan Luo

Title: Kun-Yuan Luo: Inventor in Electronic Packaging

Introduction

Kun-Yuan Luo is an inventor associated with Taichung, Taiwan, and Siliconware Precision Industries, Ltd. His patent work focuses on electronic packaging, circuit structures, and manufacturing methods. His listed portfolio includes 2 patents.

Latest Patents

Luo’s latest patents address ways to improve the design and manufacture of electronic packages.

“Electronic Package and Manufacturing Method Thereof” describes attaching an electronic element to a routing layer configured with conductive pillars, then covering the components with a cladding layer and forming an electrically connected circuit structure above it. By forming the pillars directly on the routing layer and omitting a dielectric layer, the design can facilitate a thinner electronic package.

“Electronic Package and Circuit Structure Thereof” describes a circuit structure with a dielectric layer, a circuit layer, and an electrical function part. At a right-angle corner of the dielectric layer, the electrical function part, the circuit routing path, or both use a non-right-angle shape. This approach is intended to reduce stress concentration and help prevent package warping.

Career Highlights

Luo’s listed work at Siliconware Precision Industries, Ltd. centers on electronic packaging and circuit design. The two described inventions address package thickness and mechanical stress, both relevant considerations in package construction.

Collaborations

Fang-Lin Tsai and Wei-Son Tsai are identified as Luo’s coworkers. The information provided does not specify their roles in the patents or whether they collaborated with him on these inventions.

Conclusion

Kun-Yuan Luo’s patent work reflects a focus on practical electronic-package improvements, including thinner package structures and designs intended to reduce stress and warping.