The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Jun. 30, 2023
Siliconware Precision Industries Co., Ltd., Taichung City, TW;
Fang-Lin Tsai, Taichung City, TW;
Wei-Son Tsai, Taichung City, TW;
Kun-Yuan Luo, Taichung City, TW;
Pei-Geng Weng, Taichung City, TW;
Ching-Hung Tseng, Taichung City, TW;
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung City, TW;
Abstract
An electronic package and a circuit structure thereof are provided, in which a circuit layer and an electrical function part are formed on a dielectric layer of the circuit structure, and the dielectric layer has at least one corner at a right angle, where a shape of the electrical function part at the corner and corresponding to the right angle is of a non-right angle shape and/or a routing path of the circuit layer at the corner and corresponding to the right angle is of a non-right angle shape, so that stress concentration can be reduced, thereby preventing the electronic package from warping.