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Taipei, Taiwan

Kun-Mo Lin

This inventor holds 3 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2019-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kun-Mo Lin. Retrieved from https://idiyas.com/inventor/kun-mo-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3

% Patents Active = 100.0

Average Co-Inventor Count = 5.6

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:

goldMedal3 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2019-2023

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3 patents (USPTO):Explore Patents
1. 11725278 - Systems and methods for a plasma enhanced deposition of material on a semiconductor substrate (2023-08-15),
2. 10519545 - Systems and methods for a plasma enhanced deposition of material on a semiconductor substrate (2019-12-31),
3. 10269573 - Device and method for manufacturing a semiconductor structure (2019-04-23),

Title: Inventor Kun-Mo Lin - Revolutionizing Technology in New Taipei

Introduction: Kun-Mo Lin is a visionary inventor based in New Taipei, Taiwan, known for his groundbreaking contributions to the field of technology.

Latest Patents: Kun-Mo Lin holds several patents in the areas of artificial intelligence, robotics, and renewable energy technologies, showcasing his innovative mindset and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Kun-Mo Lin has worked with leading tech companies and research institutions, consistently pushing the boundaries of what is possible in the realm of technology.

Collaborations: Throughout his career, Kun-Mo Lin has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and creativity in all his projects.

Conclusion: Kun-Mo Lin's passion for innovation and his relentless pursuit of technological advancement make him a true pioneer in the world of inventions, shaping the future of technology in New Taipei and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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