Kun-Mao Wu

Title: Kun-Mao Wu: Innovator in Capacitor Technology

Introduction

Kun-Mao Wu is a prominent inventor based in Pingzhen, Taiwan. He has made significant contributions to the field of capacitor technology, holding a total of 3 patents. His innovative methods have advanced the design and functionality of capacitors, which are essential components in various electronic devices.

Latest Patents

One of Kun-Mao Wu's latest patents involves a method of forming a high-density capacitor. This method includes forming a portion of a metallization layer on a substrate, creating a via layer, and establishing a first electrode that is electrically connected to the metallization layer. Additionally, a second electrode is formed, which is connected to the via layer, with a dielectric layer positioned between the two electrodes. This design ensures that the electrodes are not electrically connected to any other conductors except through their respective layers. Another notable patent focuses on forming metal-insulator-metal capacitors over a top metal layer, utilizing an Ultra-Thick Metal (UTM) layer and a Metal-Insulator-Metal (MIM) capacitor to enhance performance.

Career Highlights

Kun-Mao Wu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to innovate in the semiconductor industry. His work has been instrumental in developing advanced capacitor technologies that improve the efficiency and reliability of electronic components.

Collaborations

Throughout his career, Kun-Mao Wu has collaborated with notable colleagues, including Chih-Hsun Lin and Yu-Lung Yeh. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Kun-Mao Wu's contributions to capacitor technology exemplify his dedication to innovation and excellence in the field. His patents reflect a deep understanding of electronic components and their applications, making him a valuable asset to the industry.