Kun-Lin Chuang

Title: Kun-Lin Chuang: Innovator in Electronic Device Packaging

Introduction

Kun-Lin Chuang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electronic device packaging, holding a total of six patents. His innovative work focuses on enhancing the functionality and efficiency of electronic devices through advanced packaging techniques.

Latest Patents

Among his latest patents is a package of electronic devices and display panels. This invention includes a substrate, at least one electronic device, and an encapsulation layer. The substrate features a device area and a light transmitting area located outside the device area. The encapsulation layer covers the electronic device and extends from the device area to the light transmitting area, with varying nitrogen content. Another notable patent is for an electronic device package that comprises a substrate, an electronic device, and a first packaging layer. This packaging layer includes two oxynitride layers, with specific compositions that enhance the device's performance.

Career Highlights

Kun-Lin Chuang has worked with esteemed organizations such as the Industrial Technology Research Institute and the Intellectual Property Innovation Corporation. His experience in these institutions has allowed him to develop and refine his innovative ideas in electronic device packaging.

Collaborations

Throughout his career, Kun-Lin has collaborated with notable colleagues, including Hsiao-Fen Wei and Yen-Ching Kuo. These partnerships have contributed to the advancement of technology in their respective fields.

Conclusion

Kun-Lin Chuang's contributions to electronic device packaging demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in electronic device design and functionality.