The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

May. 03, 2018
Applicants:

Industrial Technology Research Institute, Hsinchu, TW;

Intellectual Property Innovation Corporation, Hsinchu, TW;

Inventors:

Hsiao-Fen Wei, New Taipei, TW;

Kun-Lin Chuang, Hsinchu, TW;

Yen-Ching Kuo, Keelung, TW;

Kuan-Ting Chen, Yunlin County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 33/52 (2010.01); H01L 23/00 (2006.01); H01L 51/52 (2006.01); H01L 27/32 (2006.01); H01L 33/48 (2010.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 51/44 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 33/52 (2013.01); H01L 23/291 (2013.01); H01L 23/3135 (2013.01); H01L 23/564 (2013.01); H01L 27/326 (2013.01); H01L 33/483 (2013.01); H01L 51/448 (2013.01); H01L 51/52 (2013.01); H01L 51/5256 (2013.01); H01L 33/56 (2013.01);
Abstract

An electronic device package includes a substrate, an electronic device, and a first packaging layer. The electronic device and the first packaging layer are disposed on the substrate and the electronic device is located between the substrate and the first packaging layer. The first packaging layer includes a first oxynitride layer and a second oxynitride layer, wherein the second oxynitride layer is located between the first oxynitride layer and the electronic device. A composition of the first oxynitride layer includes SiNO, a composition of the second oxynitride layer includes SiNO, and x1>x2.


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