The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

May. 10, 2017
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Hsiao-Fen Wei, New Taipei, TW;

Kun-Lin Chuang, Hsinchu, TW;

Chao-Jen Wang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/041 (2006.01); G06F 3/044 (2006.01); G06F 1/16 (2006.01); B32B 7/12 (2006.01); B32B 37/00 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0412 (2013.01); B32B 7/12 (2013.01); B32B 37/025 (2013.01); G06F 1/1652 (2013.01); G06F 3/044 (2013.01); B32B 2255/26 (2013.01); B32B 2363/00 (2013.01); B32B 2457/208 (2013.01); G06F 2203/04102 (2013.01); G06F 2203/04103 (2013.01);
Abstract

According an embodiment of the disclosure, a flexible electronic device is provided. The flexible electronic device may include a flexible substrate, a device layer, and a barrier planarization layer. The device layer is located on the flexible substrate and has an upper surface. The upper surface has a maximum height difference less than or equal to 900 nm in a film stacking direction. The barrier planarization layer covers the device layer and the flexible substrate and has a covering surface and a planarization surface opposite to the covering surface. The barrier planarization layer has a water vapor transmission rate lower than or equal to 10g/m-day.


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