logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9770889 B1

PDFFull Text
Date of Patent:
Sep. 26, 2017

Filed:

Feb. 17, 2015

Composite plate structure and flexible apparatus

Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Hsiao-Fen Wei, New Taipei, TW;

Kun-Lin Chuang, Hsinchu, TW;

Assignee:

Industrial Technology Research Institute, Hsinchu, TW;

Attorney:

Jianq Chyun IP Office

Primary Examiner:

Randy Gulakowski

Assistant Examiner:

Ha S Nguyen

Int. Cl.
CPC ...
B32B 27/28 (2006.01); B32B 7/06 (2006.01); B32B 3/04 (2006.01); B32B 27/08 (2006.01); B32B 7/12 (2006.01); B32B 27/34 (2006.01); B32B 27/38 (2006.01); B32B 37/26 (2006.01); C08K 3/32 (2006.01); C08K 5/5435 (2006.01); C08K 5/3415 (2006.01); C08K 5/42 (2006.01); C08K 5/56 (2006.01); C08K 5/544 (2006.01); C08K 5/07 (2006.01); C08K 3/36 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
B32B 27/281 (2013.01); B32B 3/04 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/34 (2013.01); B32B 27/38 (2013.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); C08K 5/07 (2013.01); C08K 5/3415 (2013.01); C08K 5/42 (2013.01); C08K 5/5435 (2013.01); C08K 5/5442 (2013.01); C08K 5/56 (2013.01); B32B 2264/102 (2013.01); B32B 2307/7244 (2013.01); B32B 2307/7265 (2013.01); B32B 2307/73 (2013.01); B32B 2307/748 (2013.01); C08K 2003/2227 (2013.01); Y10T 428/31511 (2015.04); Y10T 428/31663 (2015.04); Y10T 428/31721 (2015.04); Y10T 428/31725 (2015.04); Y10T 428/31765 (2015.04);
Abstract

A composite plate structure including a flexible substrate and a release layer is provided. The flexible substrate has an upper surface and a lower surface. The release layer is disposed on the lower surface of the flexible substrate, and includes a hydrophobic material and a bonding material. The hydrophobic material includes at least one fluorine atom. The bonding material at least includes an amide functional group or an epoxy functional group. The bonding material is bonded to the flexible substrate through the amide functional group or the epoxy functional group. A flexible apparatus including the composite plate structure is also provided.

Find Patent Forward Citations

Loading…