Asan-si, South Korea

Kun-Dae Yeom


Average Co-Inventor Count = 2.6

ph-index = 1

Forward Citations = 140(Granted Patents)


Location History:

  • Cheonan, KR (2008)
  • Chungcheongnam-do, KR (2010)
  • Asan-si, KR (2019 - 2020)

Company Filing History:


Years Active: 2008-2020

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4 patents (USPTO):Explore Patents

Title: Kun-Dae Yeom: Innovator in Semiconductor Packaging

Introduction

Kun-Dae Yeom is a prominent inventor based in Asan-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.

Latest Patents

One of his latest patents is for a package substrate for a semiconductor package that features landing pads extending toward a through-hole in a chip mounting region. This innovative design includes a package substrate with at least one through-hole, along with a plurality of wiring patterns on the top surface. The wiring patterns consist of respective extension portions and landing pads, with some landing pads obliquely extending toward the through-hole. Conductive bumps are formed on these landing pads to connect to a semiconductor chip mounted on the substrate. Additionally, a molding material fills the through-hole, providing structural integrity.

Another notable patent involves a semiconductor package that includes landing pads extending at an oblique angle toward a through-hole in the package substrate. Similar to his previous patent, this design incorporates a package substrate with wiring patterns and landing pads that facilitate connections to a semiconductor chip. The innovative approach ensures improved performance and reliability in semiconductor applications.

Career Highlights

Kun-Dae Yeom is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the industry.

Collaborations

Throughout his career, Kun-Dae has collaborated with talented individuals such as Baek Ki and Tark-Hyun Ko. These collaborations have fostered a creative environment that has led to innovative solutions in semiconductor packaging.

Conclusion

Kun-Dae Yeom's contributions to semiconductor packaging demonstrate his expertise and commitment to innovation. His patents reflect a deep understanding of the complexities involved in semiconductor technology, making him a valuable asset to the field.

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