The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2008
Filed:
Apr. 29, 2004
Kun-dae Yeom, Cheonan, KR;
Kun-Dae Yeom, Cheonan, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A unit semiconductor chip and stacked semiconductor package and method of manufacturing with center bonding pads and at least one circuit layer to reduce the length of bonding. The unit semiconductor chip includes a first series of bonding wires connected to a plurality of center bonding pads of a semiconductor chip, at least one circuit layer connected to the first series of bonding wires and including a series of circuit layer wiring patterns, and a second series of bonding wires connecting the series of circuit layer wiring patterns and a series of wiring patterns. The stacked semiconductor package further includes a second series of wiring patterns, connected to the first series of wiring patterns, the a second series of wiring patterns and the series of circuit layer wiring patterns providing connections to adjacent lower and upper unit semiconductor packages, respectively.