Cheonan-si, South Korea

Kun-dae Yeom

USPTO Granted Patents = 7 

Average Co-Inventor Count = 3.0

ph-index = 3

Forward Citations = 57(Granted Patents)


Company Filing History:


Years Active: 2009-2016

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7 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Kun-dae Yeom

Introduction

Kun-dae Yeom, a distinguished inventor hailing from Cheonan-si, South Korea, has made significant contributions to the field of semiconductor technology. With a total of seven patents to his name, Yeom continues to push the boundaries of innovation, driven by a commitment to advanced technological solutions.

Latest Patents

Yeom's latest patents showcase his expertise and ingenuity. One notable invention is a semiconductor package that includes multiple chips and separate groups of leads. This innovative design allows for the leads to be exposed to the outside of the semiconductor package, enhancing functionality and efficiency. Additionally, his patent for a land grid array (LGA) package addresses the challenge of decreasing the height difference between a land and a solder resist, consisting of a substrate with multiple lands and a semiconductor chip mounted on it.

Career Highlights

Currently employed by Samsung Electronics Co., Ltd., Kun-dae Yeom has established himself as a key player in the semiconductor industry. His work involves the development of advanced packaging solutions that improve performance and versatility in various electronic applications.

Collaborations

Throughout his career, Yeom has collaborated with notable colleagues including Gwang-Man Lim and Chul Hwan Park. These professional relationships foster an environment of creativity and innovation, contributing to the successful development of cutting-edge technologies.

Conclusion

In conclusion, Kun-dae Yeom's contributions to the field of semiconductor technology and his portfolio of patents exemplify his role as a leading inventor. His ongoing work at Samsung Electronics Co., Ltd. and collaborations with talented individuals like Lim and Park will undoubtedly continue to shape the future of this dynamic industry.

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