The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2009
Filed:
Aug. 30, 2005
Young-min Lee, Asan-si, KR;
Kun-dae Yeom, Cheonan-si, KR;
Young-min Lee, Asan-si, KR;
Kun-dae Yeom, Cheonan-si, KR;
Samsung Electronics Co., Ltd, Gyeonggi-do, KR;
Abstract
A package may include a stack of unit chip packages, and each unit chip package may include a printed circuit board. The printed circuit board may support a semiconductor chip and a connection terminal for connecting to an adjacent unit chip package within the stack. A dummy package substrate may be disposed on the semiconductor chip of the uppermost unit chip package for protecting the semiconductor chip of the uppermost unit chip package. A method of fabricating a package may involve stacking unit chip packages so that the printed circuit board of a lower unit chip package abuts against a solder bump of an upper unit chip package, and stacking a dummy package substrate on the printed circuit board of an uppermost unit chip package.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile