The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2014
Filed:
Jun. 17, 2011
Applicants:
Yun-rae Cho, Seoul, KR;
Kun-dae Yeom, Cheonan-si, KR;
Inventors:
Yun-Rae Cho, Seoul, KR;
Kun-Dae Yeom, Cheonan-si, KR;
Assignee:
SAMSUNG Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package including a protection layer, a plurality of semiconductor chips stacked on the protection layer, an inner encapsulant disposed on the protection layer to surround side surfaces of the semiconductor chips, and a terminal disposed to be buried in an upper portion of the inner encapsulant. Herein, each of the semiconductor chips includes an active surface, an inactive surface opposite to the active surface, and a chip pad disposed on a portion of the active surface, and an upper surface of the terminal is exposed from an upper surface of the inner encapsulant.