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For the Inventor, By the Inventor

Folsom, CA, United States of America

Kuljeet Singh

This inventor holds 8 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2002-2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kuljeet Singh. Retrieved from https://idiyas.com/inventor/kuljeet-singh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 8

% Patents Active = 87.5

Average Co-Inventor Count = 2.5

ph-index = 5

Forward Citations = 58(Granted Patents)


Location History:

  • Orangevale, CA (US) (2003 - 2004)
  • Folsom, CA (US) (2002 - 2007)

Company Filing History:

goldMedal8 out of 56,322 
 
Intel Corporation
 patents

Years Active: 2002-2007

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8 patents (USPTO):Explore Patents
1. 7282796 - Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts (2007-10-16),
2. 7247517 - Method and apparatus for a dual substrate package (2007-07-24),
3. 7064431 - Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contacts (2006-06-20),
4. 6885102 - Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts (2005-04-26),
5. 6764877 - Method of dissipating static electric charge from a chip assembly during a manufacturing operation (2004-07-20),
6. 6715663 - Wire-bond process flow for copper metal-six, structures achieved thereby, and testing method (2004-04-06),
7. 6566741 - Grounding of package substrates (2003-05-20),
8. 6404067 - Plastic ball grid array package with improved moisture resistance (2002-06-11),

Title: Kuljeet Singh: Innovator in Electronic Assembly Technology

Introduction

Kuljeet Singh is a prominent inventor based in Folsom, CA, known for his contributions to electronic assembly technology. With a total of 8 patents to his name, Singh has made significant advancements in the field, particularly in the design and functionality of electronic components.

Latest Patents

Singh's latest patents include innovative designs that enhance the efficiency and density of electronic assemblies. One notable patent is for an electronic assembly that features a more dense arrangement of contacts, allowing for improved routing of traces between these contacts. Another significant invention is a method and apparatus for a dual substrate package, which involves a semiconductor die with a through via, enhancing connectivity and functionality in electronic devices.

Career Highlights

Kuljeet Singh is currently employed at Intel Corporation, where he continues to push the boundaries of technology. His work at Intel has positioned him as a key player in the development of advanced electronic systems, contributing to the company's reputation for innovation.

Collaborations

Throughout his career, Singh has collaborated with notable colleagues, including Kevin E Wells and Julius Delino. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Kuljeet Singh's contributions to electronic assembly technology exemplify the spirit of innovation. His patents and work at Intel Corporation highlight his commitment to advancing the field and improving electronic systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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