The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2004
Filed:
Jan. 16, 2002
Applicant:
Inventors:
Krishna Seshan, San Jose, CA (US);
Kuljeet Singh, Folsom, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/102 ; G01R 3/102 ;
U.S. Cl.
CPC ...
B23K 3/102 ; G01R 3/102 ;
Abstract
The present invention relates to a device that includes a low-ohmic test. The device includes a metallization copper pad such as metal-six, a metal first film such as Ni that is disposed above the metallization copper pad, and a metal second film such as Au that is disposed above the metal first film. The present invention also relates to a wire-bonding process, and to a method of pulling a first wire bond and making a second wire bond.
Seshan, Krishna. (2004). Wire-bond process flow for copper metal-six, structures achieved thereby, and testing method (U.S. Patent No. 6715663). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6715663
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile