Chandler, AZ, United States of America

Krishna Srinivasan

This inventor holds 5 USPTO granted patents and 1 published patent application. Top assignee: Intel Corporation. Active years: 2016-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Krishna Srinivasan. Retrieved from https://idiyas.com/inventor/krishna-srinivasan-zbjtbyek

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 5 

% Patents Active = 100.0

Average Co-Inventor Count = 4.4

ph-index = 3

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2016-2022

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5 patents (USPTO):Explore Patents

Title: Innovations by Krishna Srinivasan

Introduction

Krishna Srinivasan is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of integrated circuit packaging and electronic assemblies. With a total of 5 patents to his name, his work has had a considerable impact on technology.

Latest Patents

One of his latest patents is titled "Integrated circuit package with through void guard trace." This patent discloses apparatuses, systems, and methods associated with over void signal trace design. In this embodiment, an integrated circuit (IC) package includes a first layer that has a void and a guard trace. A first portion of the void is located on one side of the guard trace, while a second portion is located on the opposite side. Additionally, the IC package features a second layer adjacent to the first, which contains a signal trace extending along the guard trace. Other embodiments may also be described and claimed.

Another significant patent is "High density package interconnects." This patent describes electronic assemblies and methods for forming interconnect structures. In one embodiment, the apparatus includes semiconductor die and a first metal bump on the die. This bump features a surface with a first part covered by a solder-resistant coating, leaving the second part uncovered. Other embodiments are also described and claimed.

Career Highlights

Krishna Srinivasan is currently employed at Intel Corporation, where he continues to innovate and develop new technologies. His work at Intel has allowed him to explore various aspects of integrated circuit design and electronic assembly.

Collaborations

He has collaborated with notable coworkers such as Sanka Ganesan and Zhiguo Qian, contributing to advancements in their respective fields.

Conclusion

Krishna Srinivasan's contributions to the field of integrated circuits and electronic assemblies highlight his innovative spirit and dedication to technology. His patents reflect a commitment to advancing the industry and improving electronic design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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