The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2016

Filed:

Dec. 31, 2011
Applicants:

Sanka Ganesan, Chandler, AZ (US);

Zhiguo Qian, Chandler, AZ (US);

Robert L. Sankman, Phoenix, AZ (US);

Krishna Srinivasan, Chandler, AZ (US);

Zhaohui Zhu, Tempe, AZ (US);

Inventors:

Sanka Ganesan, Chandler, AZ (US);

Zhiguo Qian, Chandler, AZ (US);

Robert L. Sankman, Phoenix, AZ (US);

Krishna Srinivasan, Chandler, AZ (US);

Zhaohui Zhu, Tempe, AZ (US);

Assignee:

INTEL CORPORATION, Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 23/50 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 21/76885 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 23/50 (2013.01); H01L 23/5386 (2013.01); H01L 2224/10126 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/1182 (2013.01); H01L 2224/11831 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/1301 (2013.01); H01L 2224/131 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13562 (2013.01); H01L 2224/13687 (2013.01); H01L 2224/14133 (2013.01); H01L 2224/14135 (2013.01); H01L 2224/14136 (2013.01); H01L 2224/16013 (2013.01); H01L 2224/16014 (2013.01); H01L 2224/16058 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81385 (2013.01); H01L 2224/81395 (2013.01); H01L 2224/81411 (2013.01); H01L 2224/81439 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/381 (2013.01); H01L 2924/3841 (2013.01);
Abstract

Electronic assemblies and methods including the formation of interconnect structures are described. In one embodiment an apparatus includes semiconductor die and a first metal bump on the die, the first metal bump including a surface having a first part and a second part. The apparatus also includes a solder resistant coating covering the first part of the surface and leaving the second part of the surface uncovered. Other embodiments are described and claimed.


Find Patent Forward Citations

Ganesan, Sanka. (2016). High density package interconnects (U.S. Patent No. 9368437). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9368437

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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