The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Mar. 23, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Ananth Prabhakumar, Gilbert, AZ (US);

Krishna Srinivasan, Chandler, AZ (US);

Arnab Sarkar, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/525 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 23/5256 (2013.01);
Abstract

Apparatuses, systems and methods associated with over void signal trace design are disclosed herein. In embodiments, an integrated circuit (IC) package may include a first layer that has a void and a guard trace, wherein a first portion of the void is located on a first side of the guard trace and a second portion of the void is located on a second side of the guard trace. The IC package may further include a second layer located adjacent to the first layer, wherein the second layer has a signal trace that extends along the guard trace. Other embodiments may be described and/or claimed.


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