Seoul, South Korea

KooWoong Jeong

USPTO Granted Patents = 3 

Average Co-Inventor Count = 11.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2018-2024

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3 patents (USPTO):Explore Patents

Title: KooWoong Jeong: Innovator in Semiconductor Technology

Introduction

KooWoong Jeong is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative methods and designs that enhance semiconductor packaging.

Latest Patents

One of KooWoong Jeong's latest patents is a semiconductor package and manufacturing method. This invention provides a semiconductor package that includes a substrate with a first surface and a second surface opposite to the first surface. The design features at least one first recess portion formed in a direction from the first surface toward the second surface. Additionally, it incorporates a plurality of first recess conductive patterns formed in the first recess portion, along with a first passive element inserted into the first recess portion of the substrate. This passive element has a first electrode and a second electrode that are electrically connected to the plurality of first recess conductive patterns.

Career Highlights

KooWoong Jeong has worked with notable companies in the semiconductor industry, including Amkor Technology Singapore Holding Pte. Ltd. and Amkor Technology, Inc. His experience in these organizations has contributed to his expertise in semiconductor packaging and manufacturing processes.

Collaborations

Throughout his career, KooWoong Jeong has collaborated with talented individuals such as Jae Ung Lee and Yung Woo Lee. These collaborations have fostered innovation and advancement in semiconductor technology.

Conclusion

KooWoong Jeong is a distinguished inventor whose work in semiconductor packaging has led to valuable patents and advancements in the field. His contributions continue to influence the industry and pave the way for future innovations.

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