Company Filing History:
Years Active: 2016-2017
Title: KooHong Lee: Innovator in Semiconductor Technology
Introduction
KooHong Lee is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on innovative methods for bonding semiconductor devices, which are crucial for the advancement of electronic components.
Latest Patents
One of KooHong Lee's latest patents is titled "Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form." This invention describes a semiconductor device that features multiple semiconductor die arranged over a carrier. An electrical interconnect, such as a stud bump, is formed over the semiconductor die, which are then trimmed to a uniform height. The substrate includes a bump that allows for the bonding of the electrical interconnects to the substrate while the semiconductor die are still on the carrier. The process involves depositing an underfill material between the semiconductor die and the substrate, or alternatively, using an encapsulant applied with a chase mold. The bonding process utilizes gang reflow or thermocompression techniques, enhancing the throughput of flip-chip type interconnects to the substrate.
Career Highlights
KooHong Lee is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in semiconductor technology. His expertise and inventions have positioned him as a key figure in the industry, contributing to advancements that improve the efficiency and performance of semiconductor devices.
Collaborations
Throughout his career, KooHong Lee has collaborated with notable colleagues, including KyungMoon Kim and JaeHak Yee. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
KooHong Lee's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to impact the development of advanced electronic components, paving the way for future innovations.
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