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For the Inventor, By the Inventor

Teublitz, Germany

Konrad Roesl

USPTO Granted Patents = 13 

Average Co-Inventor Count = 4.1

ph-index = 2

Forward Citations = 15(Granted Patents)


Company Filing History:

goldMedal10 out of 14,705 
 
Infineon Technologies Ag
 patents
silverMedal3 out of 2,093 
 
Infineon Technologies Austria Ag
 patents

Years Active: 2010-2025

where 'Filed Patents' based on already Granted Patents

13 patents (USPTO):
1. 12255168 - Electronic device with multi-layer contact and system (2025-03-18),
2. 12166005 - Semiconductor device having a soldered joint with one or more intermetallic phases (2024-12-10),
3. 11842975 - Electronic device with multi-layer contact and system (2023-12-12),
4. 11605608 - Preform diffusion soldering (2023-03-14),
5. 11158602 - Batch diffusion soldering and electronic devices produced by batch diffusion soldering (2021-10-26),
6. 10475761 - Method for producing electronic device with multi-layer contact (2019-11-12),
7. 9673170 - Batch process for connecting chips to a carrier (2017-06-06),
8. 9490193 - Electronic device with multi-layer contact (2016-11-08),
9. 9079318 - Self-aligning pick-up head and method for manufacturing a device with the self-aligning pick-up head (2015-07-14),
10. 9034751 - Method for mounting a semiconductor chip on a carrier (2015-05-19),
11. 8802553 - Method for mounting a semiconductor chip on a carrier (2014-08-12),
12. 7874475 - Method for the planar joining of components of semiconductor devices and a diffusion joining structure (2011-01-25),
13. 7781897 - Semiconductor device and method for producing the same (2010-08-24),

Title: The Innovative Contributions of Konrad Roesl

Introduction

Konrad Roesl is a notable inventor based in Teublitz, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 13 patents. His work focuses on enhancing the functionality and efficiency of electronic devices.

Latest Patents

Among his latest patents is an electronic device with a multi-layer contact and system. This invention describes a semiconductor device that includes a semiconductor substrate with electrode terminals on opposite surfaces. The device features an electrical contact layer, a functional layer, an adhesion layer, a solder layer, and a protection layer, all designed to facilitate vertical current flow. Another significant patent involves a semiconductor device with a soldered joint that contains one or more intermetallic phases. This invention ensures a robust connection between the semiconductor die and the substrate, enhancing the overall performance of the device.

Career Highlights

Konrad Roesl has worked with prominent companies in the semiconductor industry, including Infineon Technologies AG and Infineon Technologies Austria AG. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in semiconductor technology.

Collaborations

Throughout his career, Roesl has collaborated with talented individuals such as Alexander Heinrich and Oliver Eichinger. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Konrad Roesl's contributions to the field of semiconductor technology are noteworthy. His innovative patents and collaborations with industry professionals highlight his commitment to advancing electronic device functionality. His work continues to influence the semiconductor landscape significantly.

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