The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2011
Filed:
Dec. 07, 2006
Khalil Hosseini, Weihmichl, DE;
Joachim Mahler, Regensburg, DE;
Edmund Riedl, Obertraubling-Gebelkofen, DE;
Ivan Galesic, Regensburg, DE;
Konrad Roesl, Teublitz, DE;
Khalil Hosseini, Weihmichl, DE;
Joachim Mahler, Regensburg, DE;
Edmund Riedl, Obertraubling-Gebelkofen, DE;
Ivan Galesic, Regensburg, DE;
Konrad Roesl, Teublitz, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A method for the planar joining of components of semiconductor devices involves coating the components with diffusion materials on their upper sides and rear sides, respectively. Subsequently, the components to be joined one on the other are introduced into a reducing atmosphere. The components are aligned and a compressive pressure is exerted on the aligned components. While heating up the components to be joined in the reducing atmosphere to a diffusion joining temperature, isothermal solidification takes place, the diffusion joining temperature lying below the melting temperature of the forming diffusion joint of the joined material.