This inventor holds 2 USPTO granted patents and 5 published patent applications. Top assignee: Resonac Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Koichi Kagesawa: Innovator in Semiconductor Polishing Technology
Introduction
Koichi Kagesawa is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, particularly in polishing methods that enhance the production of semiconductor components. His innovative approach has led to the development of a unique slurry that improves the efficiency and effectiveness of polishing processes.
Latest Patents
Kagesawa holds a patent for a slurry, polishing method, and method for producing semiconductor components. This patent describes a slurry that contains abrasive grains, a compound with three or more carbon atoms, and water. The abrasive grains specifically include cerium oxide, and the dispersion term in Hansen solubility parameters of the compound is 18.0 MPa or less. This innovative polishing method allows for the effective polishing of surfaces using the developed slurry.
Career Highlights
Kagesawa is currently employed at Resonac Corporation, where he continues to work on advancements in semiconductor technology. His expertise in polishing methods has positioned him as a key figure in the industry, contributing to the development of more efficient manufacturing processes.
Collaborations
Throughout his career, Kagesawa has collaborated with notable colleagues, including Satoshi Furukawa and Tomohiro Iwano. These collaborations have fostered an environment of innovation and have led to further advancements in the field of semiconductor technology.
Conclusion
Koichi Kagesawa's contributions to semiconductor polishing technology through his innovative slurry and methods have made a significant impact in the industry. His work at Resonac Corporation and collaborations with fellow inventors highlight his commitment to advancing technology in this critical field.