The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Sep. 15, 2021
Applicant:
Resonac Corporation, Tokyo, JP;
Inventors:
Shigeki Kubota, Tokyo, JP;
Tomohiro Iwano, Tokyo, JP;
Satoshi Furukawa, Tokyo, JP;
Koichi Kagesawa, Tokyo, JP;
Atsuko Ueda, Tokyo, JP;
Assignee:
Resonac Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/304 (2006.01); H01L 21/3105 (2006.01); H10D 89/00 (2025.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); H01L 21/304 (2013.01); H01L 21/31053 (2013.01); H10D 89/013 (2025.01);
Abstract
A slurry containing: abrasive grains; a compound X; and water, in which the abrasive grains contain cerium oxide, and a hydrogen bond term dH in Hansen solubility parameters of the compound X is 15.0 MPaor more. A polishing method including polishing a surface to be polished by using this slurry.