IDiyas

For the Inventor, By the Inventor

Machida, Japan

Kohichiro Kawate

USPTO Granted Patents = 14

Average Co-Inventor Count = 2.0

ph-index = 5

Forward Citations = 95(Granted Patents)


Location History:

  • Machinda, JP (2016)
  • Machida, JP (1995 - 2017)
  • Tokyo, JP (2001 - 2021)

Company Filing History:

goldMedal12 out of 14,059 
 
3m Innovative Properties Company
 patents
silverMedal2 out of 7,865 
 
Minnesota Mining and Manufacturing Company
 patents

Years Active: 1995-2021

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14 patents (USPTO):Explore Patents
1. 11124646 - Heat-dissipating resin composition, cured product thereof, and method of using same (2021-09-21),
2. 9773714 - Semiconductor package resin composition and usage method thereof (2017-09-26),
3. 9281255 - Underfill composition and semiconductor device and manufacturing method thereof (2016-03-08),
4. 9230873 - Semiconductor package resin composition and usage method thereof (2016-01-05),
5. 7888604 - Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method (2011-02-15),
6. 7779538 - Method for mutually connecting circuit boards (2010-08-24),
7. 7358289 - Heat-curable adhesive composition (2008-04-15),
8. 6908318 - Batch electrically connecting sheet (2005-06-21),
9. 6753379 - Heat activated adhesive (2004-06-22),
10. 6265460 - Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition (2001-07-24),
11. 6228500 - Adhesive composition and precursor thereof (2001-05-08),
12. 6051652 - Reactive hot melt composition, composition for preparation of reactive (2000-04-18),
13. 5759090 - Sanding pad containing a heat distortable polymer and sanding process (1998-06-02),
14. 5382641 - Heat-sensitive imaging material (1995-01-17),
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