3m Innovative Properties Company

Minnesota Mining and Manufacturing Company

Kohichiro Kawate

Shigeyoshi Ishii

Brant Ulrick Kolb

Eric G Larson

Naota Sugiyama

Hiroko Akiyama

Mario Alberto Perez

Jun Fujita

Alexander Barr

Yuji Hiroshige

Andrew C Lottes

James G Vana, Jr

Naoyuki Toriumi

Yoshiaki Sato

James R White

Barbara L Birrell

Hiroshi Imai

Sadao Yoshizaki

Hitoshi Furutani

Akito Muramatsu

Hitoshi Yamaguchi

Yorinobo Takamatsu

To provide a heat-dissipating resin composition, and cured product thereof, which can effectively transmit heat generated from a heat-generating part such as a semiconductor element or the like with a high heating value to an object such as a substrate, heat sink, shield can lid, housing, or the like, and reduce defects such as contact failure of a relay or connector, or the like. A heat-dissipating resin composition of an embodiment of the present disclosure includes: component (A): epoxy resin; component (B): curing agent for epoxy resin; component (C): (meth)acrylic oligomer with weight average molecular weight of 10,000 or less; and component (D): heat conductive particles.

Heat-dissipating resin composition, cured product thereof, and method of using same

A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.

Semiconductor package resin composition and usage method thereof

To provide a solid preapplication underfill material that has excellent workability, has a high degree of freedom for solder bonding processes, and enables the formation of a solder bond with high reliability. (Resolution Means) The underfill composition of the present disclosure contains a hardened epoxy resin and has a viscosity of 1000 Pa&#xb7;s or more at 30&#xb0; C. The hardening epoxy resin includes a crystalline epoxy resin at not less than 50 wt % relative to an entire resin composition.

Underfill composition and semiconductor device and manufacturing method thereof

Provided is a method of connecting conductive traces on one substrate to conductive traces on another substrate using an adhesive containing conductive particles and the resulting article.

Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method

A method for connecting circuit boards, comprising: (i) preparing a first circuit board having connection parts assigned to end parts of a plurality of conductor wirings, and a second circuit board having connection parts assigned to corresponding end parts of a plurality of conductor wirings; (ii) disposing the connection parts of the first circuit board to face the connection parts of the second circuit board with a thermosetting adhesive film between the connection parts of the circuit boards; and (iii) applying heat and pressure to the connection parts and to the thermosetting adhesive film sufficiently high to thoroughly push away the adhesive film so as to establish electrical contact between connection parts of the circuit boards facing each other and to allow for curing of the adhesive; wherein the conductor wirings constituting the connection parts of at least one of the first and second circuit boards contain non-linear wirings.

Method for mutually connecting circuit boards

The present invention provides a heat-curable adhesive composition comprising ethylene-glycidyl (meth)acrylate copolymer, low density polyethylene, ethylene-a-olefin copolymer, and a heat curing agent for the ethylene-glycidyl (meth)acrylate copolymer.

Heat-curable adhesive composition

A batch electrically connecting sheet makes it possible to form an electric connection with mechanical, thermal, and electrical stability at plural points of contact. A batch electrically connecting sheet comprises a heat-resistant sheet having plural perforations, conductive blocks, inserted in the perforations, having ridges including indentations and projections; the projections are outstanding from the perforations, and the conductive blocks are thicker than the heat-resistant sheet, and the heat-resistant sheet has an adhesive layer composed of a heat curable adhesive agent applied on at least one surface thereof, covering the projections of the conductive blocks.

Batch electrically connecting sheet

The present invention provides thermally activated adhesive compositions comprising polymer and polyester wherein the adhesive polymer comprises a polymer having hydroxyl and phenyl groups and adhesive films made from the adhesive compositions.

Heat activated adhesive

A hot-melt adhesive composition, which has a high curing rate, requires no water for a curing reaction or no solvent for the formation of a film, has good storage stability, and is suitable for adhering electronic parts or producing integrated circuit (IC) packages is provided. Specifically, a thermosetting hot-melt adhesive composition comprising a polyethylene copolymer having epoxy groups in a molecule as an epoxy component, which further comprises a cationic polymerization catalyst, is provided herein. Also disclosed are heat-bonding film adhesives and adhering methods using the hot-melt adhesive composition.

Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition

An adhesive composition, which is useful as an adhesive for FPC protective film and is particularly superior in dimensional stability and adhesion is described herein. The adhesive composition comprises a resin component containing an phenoxy resin, an epoxy resin and a curing agent, characterized in that said resin component further contains a polyester polyol and an inorganic colloid dispersed in said resin component.

Adhesive composition and precursor thereof

Reactive hot melt composition, composition for preparation of reactive

Sanding pad containing a heat distortable polymer and sanding process

The present invention provides a heat-sensitive layer prepared by radiation polymerizing a monomer composition comprising:

Growing community of inventors

Machida, Japan

Kohichiro Kawate