The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2017
Filed:
Jul. 28, 2015
Applicant:
3m Innovative Properties Company, St. Paul, MN (US);
Inventors:
Kohichiro Kawate, Machida, JP;
Hiroko Akiyama, Sagamihara, JP;
Naota Sugiyama, Sagamihara, JP;
Brant U. Kolb, Afton, MN (US);
Eric G. Larson, Lake Elmo, MN (US);
Assignee:
3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); C08L 63/00 (2006.01); H01L 23/10 (2006.01); H01L 21/56 (2006.01); C08K 3/36 (2006.01); C08K 9/06 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 23/296 (2013.01); C08K 3/36 (2013.01); C08K 9/06 (2013.01); C08L 63/00 (2013.01); H01L 21/563 (2013.01); H01L 23/10 (2013.01); H01L 23/293 (2013.01); H01L 23/295 (2013.01); H01L 33/56 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/12044 (2013.01);
Abstract
A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.