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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9281255 B1

PDFFull Text
Expired
Date of Patent:
Mar. 08, 2016

Filed:

Oct. 29, 2013

Underfill composition and semiconductor device and manufacturing method thereof

Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventor:

Kohichiro Kawate, Tokyo, JP;

Assignee:

3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US);

Attorney:

Adam Bramwell

Primary Examiner:

Dao H Nguyen

Int. Cl.
CPC ...
H01L 23/488 (2006.01); H01L 23/29 (2006.01); H01L 21/30 (2006.01); C08F 2/46 (2006.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 21/78 (2006.01); C09K 5/14 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
H01L 23/293 (2013.01); C08K 3/22 (2013.01); C09K 5/14 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 21/78 (2013.01); H01L 23/3157 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 24/94 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); C08K 2003/2227 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01);
Abstract

To provide a solid preapplication underfill material that has excellent workability, has a high degree of freedom for solder bonding processes, and enables the formation of a solder bond with high reliability. (Resolution Means) The underfill composition of the present disclosure contains a hardened epoxy resin and has a viscosity of 1000 Pa·s or more at 30° C. The hardening epoxy resin includes a crystalline epoxy resin at not less than 50 wt % relative to an entire resin composition.

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Kawate, Kohichiro. (2016). Underfill composition and semiconductor device and manufacturing method thereof (U.S. Patent No. 9281255). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9281255

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