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For the Inventor, By the Inventor

Singapore, Singapore

Kock Liang Heng

USPTO Granted Patents = 10

Average Co-Inventor Count = 4.1

ph-index = 5

Forward Citations = 284(Granted Patents)


Company Filing History:

goldMedal10 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2010-2015

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10 patents (USPTO):Explore Patents
1. 9054083 - Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support (2015-06-09),
2. 9029193 - Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support (2015-05-12),
3. 8659162 - Semiconductor device having an interconnect structure with TSV using encapsulant for structural support (2014-02-25),
4. 8263439 - Semiconductor device and method of forming an interposer package with through silicon vias (2012-09-11),
5. 8125073 - Wafer integrated with permanent carrier and method therefor (2012-02-28),
6. 8067308 - Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support (2011-11-29),
7. 8049328 - Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support (2011-11-01),
8. 7880293 - Wafer integrated with permanent carrier and method therefor (2011-02-01),
9. 7838337 - Semiconductor device and method of forming an interposer package with through silicon vias (2010-11-23),
10. 7741148 - Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support (2010-06-22),

Title: Kock Liang Heng: Innovator in Semiconductor Technology

Introduction

Kock Liang Heng is a prominent inventor based in Singapore, known for his significant contributions to the field of semiconductor technology. With a total of 10 patents to his name, he has made remarkable advancements that enhance the efficiency and functionality of semiconductor devices.

Latest Patents

His latest patents include innovative designs and methods for semiconductor devices. One notable patent is for a semiconductor device and method of making TSV interconnect structures using encapsulant for structural support. This invention features a substrate with a via extending through it, incorporating a first insulating layer and an electrically conductive material to form a through-silicon via (TSV). The design also includes interconnect structures that are electrically connected to the TSV, ensuring robust performance.

Another significant patent focuses on a semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support. This invention involves a first interconnect structure on one side of a substrate, with a semiconductor die mounted on it. An encapsulant is deposited for structural support, and a TSV is formed to connect to a second interconnect structure, enhancing the device's overall robustness and functionality.

Career Highlights

Kock Liang Heng is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.

Collaborations

Throughout his career, Kock has collaborated with talented individuals such as Pandi Chelvam Marimuthu and Nathapong Suthiwongsunthorn. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Kock Liang Heng's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence the industry and pave the way for future innovations in semiconductor devices.

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