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For the Inventor, By the Inventor

Tokyo, Japan

Ko Inaba

USPTO Granted Patents = 4 

 

Average Co-Inventor Count = 3.7

ph-index = 2

Forward Citations = 11(Granted Patents)


Location History:

  • Edogawa-ku, JP (2012)
  • Tokyo, JP (2021 - 2023)

Company Filing History:

goldMedal2 out of 336 
 
Senju Metal Industry Co., Ltd.
 patents
silverMedal2 out of 4,154 
 
Lenovo (singapore) Pte. Ltd.
 patents
bronzeMedal1 out of 13,692 
 
Murata Manufacturing Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2012-2023

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4 patents (USPTO):Explore Patents
1. 11628519 - Solder joint (2023-04-18),
2. 11097379 - Solder bonding method and solder joint (2021-08-24),
3. 10987764 - Flux and solder paste (2021-04-27),
4. 8227536 - Lead-free solder paste and its use (2012-07-24),
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