The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2012
Filed:
Aug. 11, 2006
Shizuharu Watanabe, Omi-hachiman, JP;
Hidekiyo Takaoka, Omi-hachiman, JP;
Kosuke Nakano, Kasatsu, JP;
Masafumi Seino, Kanazawa, JP;
Ko Inaba, Edogawa-ku, JP;
Shizuharu Watanabe, Omi-hachiman, JP;
Hidekiyo Takaoka, Omi-hachiman, JP;
Kosuke Nakano, Kasatsu, JP;
Masafumi Seino, Kanazawa, JP;
Ko Inaba, Edogawa-ku, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A solder paste comprising a solder alloy powder and a flux. The volumetric expansion at the time of melting of the solder alloy is at most 0.5%. The flux contains a bisphenol A epoxy resin and a curing agent selected from a carboxylic anhydride and a dicarboxylic acid. The solder paste can be used in applications suitable for high-temperature solders. The solder alloy has an alloy composition comprising, in mass percent, 70-98% of Bi, a total of 0-0.5% of at least one substance selected from Ag, Cu, Sb, In, Zn, Ni, Cr, Fe, Mo, P, Ge, and Ga, and a remainder of Sn.