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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11628519 B1

PDFFull Text
Date of Patent:
Apr. 18, 2023

Filed:

Jun. 24, 2021

Solder joint

Applicant:

Lenovo (Singapore) Pte. Ltd., Singapore, SG;

Inventors:

Ko Inaba, Tokyo, JP;

Tetsu Takemasa, Tokyo, JP;

Tadashi Kosuga, Kanagawa, JP;

Assignee:

Lenovo (Singapore) Pte. Ltd., Singapore, SG;

Attorney:

Osha Bergman Watanabe & Burton LLP

Primary Examiner:

Devang R Patel

Int. Cl.
CPC ...
B23K 35/26 (2006.01); C22C 12/00 (2006.01); B23K 1/00 (2006.01); H05K 3/34 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2023.01); C22C 13/02 (2006.01); B23K 1/20 (2006.01); B23K 1/008 (2006.01); C22C 13/00 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 35/26 (2013.01); B23K 1/00 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 1/203 (2013.01); C22C 12/00 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H05K 3/34 (2013.01); H05K 3/3463 (2013.01); B23K 2101/42 (2018.08);
Abstract

A solder joint, for bonding an electrode of a circuit board to an electrode of an electronic component, that includes: an Sn—Bi-based solder deposited on the electrode of the circuit board; and a solder alloy deposited on the electrode of the electronic component. The Sn—Bi-based solder alloy has a lower melting point than the solder alloy deposited on the electrode of the electronic component. Fine Bi phases in the solder joint each have an area of less than or equal to 0.5 μm. Coarse Bi phases in the solder joint each have an area of greater than 0.5 μmand less than or equal to 5 μm. A proportion of the fine Bi phases among the fine Bi phases and the coarse Bi phases is greater than or equal to 60%.

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