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For the Inventor, By the Inventor

Ibaraki, Japan

Kiyohito Tanno

This inventor holds 12 USPTO granted patents and 2 EPO patents. Top assignee: Hitachi Chemical Company, Ltd.. Active years: 2001-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kiyohito Tanno. Retrieved from https://idiyas.com/inventor/kiyohito-tanno

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 12

% Patents Active = 33.3


Average Co-Inventor Count = 6.6

ph-index = 5

Forward Citations = 144(Granted Patents)


Location History:

  • Hitachi, JP (2001 - 2010)
  • Ibaraki-ken, JP (2002 - 2013)

Company Filing History:

goldMedal12 out of 1,641 
 
Hitachi Chemical Company, Ltd.
 patents

Years Active: 2001-2013

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12 patents (USPTO):Explore Patents
1. 8616936 - Abrasive, method of polishing target member and process for producing semiconductor device (2013-12-31),
2. 8162725 - Abrasive, method of polishing target member and process for producing semiconductor device (2012-04-24),
3. 8137159 - Abrasive, method of polishing target member and process for producing semiconductor device (2012-03-20),
4. 7963825 - Abrasive, method of polishing target member and process for producing semiconductor device (2011-06-21),
5. 7871308 - Abrasive, method of polishing target member and process for producing semiconductor device (2011-01-18),
6. 7867303 - Cerium oxide abrasive and method of polishing substrates (2011-01-11),
7. 7708788 - Cerium oxide abrasive and method of polishing substrates (2010-05-04),
8. 7115021 - Abrasive, method of polishing target member and process for producing semiconductor device (2006-10-03),
9. 6863700 - Cerium oxide abrasive and method of polishing substrates (2005-03-08),
10. 6420269 - Cerium oxide abrasive for polishing insulating films formed on substrate and methods for using the same (2002-07-16),
11. 6343976 - Abrasive, method of polishing wafer, and method of producing semiconductor device (2002-02-05),
12. 6221118 - Cerium oxide abrasive and method of polishing substrates (2001-04-24),

Title: Kiyohito Tanno: Innovator in Semiconductor Polishing Technology

Introduction

Kiyohito Tanno is a prominent inventor based in Ibaraki-ken, Japan. He has made significant contributions to the field of semiconductor device production, particularly in polishing technologies. With a total of 12 patents to his name, Tanno's work has had a substantial impact on the industry.

Latest Patents

One of Tanno's latest patents focuses on an abrasive and a method for polishing target members, as well as a process for producing semiconductor devices. This invention aims to polish the surfaces of SiO insulating films at a high rate without causing scratches. The abrasive comprises a slurry that includes a medium and at least one of the following: cerium oxide particles with multiple crystallites and specific bulk density, or abrasive grains with pores. This innovative approach enhances the efficiency and effectiveness of semiconductor manufacturing processes.

Career Highlights

Kiyohito Tanno is currently employed at Hitachi Chemical Company, Ltd., where he continues to develop cutting-edge technologies in the semiconductor field. His expertise in polishing methods has positioned him as a key figure in advancing manufacturing techniques.

Collaborations

Throughout his career, Tanno has collaborated with notable colleagues, including Yasushi Kurata and Jun Matsuzawa. These partnerships have fostered innovation and contributed to the success of various projects within the semiconductor industry.

Conclusion

Kiyohito Tanno's contributions to semiconductor polishing technology exemplify his dedication to innovation. His patents and work at Hitachi Chemical Company, Ltd. continue to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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